1.00mm(.039in)Pitch , Vertical , Header/Wafer , Single Row , 11 Circuits , LCP UL94V-0 , Beige , 80μin(2.03μm) , Tin(Sn) Plating , MLAY Reel
Effective
B1000H-XP-LCP_dwg.pdf
B1000.pdf
B1000_PS.pdf
This information is provided based on reasonable inquiry of our suppliers and represents our current actual knowledge based on the information they provided. This information is subject to change. The part numbers that CJT has identified as EU RoHS compliant have a maximum concentration of 0.1% by weight in homogenous materials for lead, hexavalent chromium, mercury, PBB, PBDE, DBP, BBP, DEHP, DIBP, and 0.01% for cadmium, or qualify for an exemption to these limits as defined in the Annexes of Directive 2011/65/EU (RoHS2). Finished electrical and electronic equipment products will be CE marked as required by Directive 2011/65/EU. Components may not be CE marked. Additionally, the part numbers that CJT has identified as EU ELV compliant have a maximum concentration of 0.1% by weight in homogenous materials for lead, hexavalent chromium, and mercury, and 0.01% for cadmium, or qualify for an exemption to these limits as defined in the Annexes of Directive 2000/53/EC (ELV). Regarding the REACH Regulation, the information CJT provides on SVHC in articles for this part number is based on the latest European Chemicals Agency (ECHA) ‘Guidance on requirements for substances in articles’ posted at this URL: https://echa.europa.eu/guidance-documents/guidance-on-reach
1.00mm(.039in)Pitch , Vertical , Header/Wafer , Single Row , 11 Circuits , LCP UL94V-0 , Beige , 80μin(2.03μm) , Tin(Sn) Plating , MLAY Reel
1.00mm(.039in)Pitch , Vertical , Header/Wafer , Single Row , 11 Circuits , LCP UL94V-0 , Beige , 1μin(0.025μm) , Gold (Au) Plating , MLAY Reel
1.00mm(.039in)Pitch , Vertical , Header/Wafer , Single Row , 11 Circuits , LCP UL94V-0 , Beige , 80μin(2.03μm) , Tin(Sn) Plating , MLAY Reel
1.00mm(.039in)Pitch , Vertical , Header/Wafer , Single Row , 11 Circuits , LCP UL94V-0 , Beige , 1μin(0.025μm) , Gold (Au) Plating , MLAY Reel
1.00mm(.039in)Pitch , Vertical , Header/Wafer , Single Row , 11 Circuits , LCP UL94V-0 , Beige , 80μin(2.03μm) , Tin(Sn) Plating , MLAY Reel
1.00mm(.039in)Pitch , Vertical , Header/Wafer , Single Row , 11 Circuits , LCP UL94V-0 , Beige , 80μin(2.03μm) , Tin(Sn) Plating , MLAY Reel
1.00mm(.039in)Pitch , Vertical , Header/Wafer , Single Row , 11 Circuits , LCP UL94V-0 , Beige , 80μin(2.03μm) , Tin(Sn) Plating , MLAY Reel
1.00mm(.039in)Pitch , Vertical , Header/Wafer , Single Row , 11 Circuits , LCP UL94V-0 , Beige , 1μin(0.025μm) , Gold (Au) Plating , MLAY Reel
1.00mm(.039in)Pitch , Vertical , Header/Wafer , Single Row , 11 Circuits , LCP UL94V-0 , Beige , 80μin(2.03μm) , Tin(Sn) Plating , MLAY Reel
1.00mm(.039in)Pitch , Vertical , Header/Wafer , Single Row , 11 Circuits , LCP UL94V-0 , Beige , 1μin(0.025μm) , Gold (Au) Plating , MLAY Reel
1.00mm(.039in)Pitch , Vertical , Header/Wafer , Single Row , 11 Circuits , LCP UL94V-0 , Beige , 80μin(2.03μm) , Tin(Sn) Plating , MLAY Reel
