CJT,Equivalent to TE,Molex,JST,Amphenol ICC FCI,China connectors,Wire harness,Pin Header,Wafer,Housing,Wire to board

Product centerWire-To-Board -A3501

Wafer-3.70mm Pitch，90°，SMT Wafer

A3501WRI-S-2P: Wire-To-Board; SeriesA3501 Series; Pitch3.70mm; MaterialLCP,UL94V-0; ColorNatural(Beige); >SEE ALL FEATURES

Matching Housing:

A3501HI-2P 3.70mm Pitch，Housing,

Product Type Features	Category	Wire-To-Board
	Assembly Type	Wafer
	Pitch (mm)	3.70mm
	Product Series	A3501 Series

Configuration Features	Number of Rows	1
	Number of Positions	2P

Electrical characteristics	Operating Voltage (V AC/DC)	500
	Current(Max)(A)	2
	Contact Resistance	40mΩMax
	Insulation Resistance	1000MΩMin

Shell characteristics	Housing Material	LCP,UL94V-0
	Color	Natural(Beige)
	PIN Material	Brass
	PIN Plating	Tin over Nickel

Use the environment	Operating Temperature Range (°C)	-40℃~105℃

Industry Standard	UL/CUL	E326732