Product centerWire-To-Board -A1201

Wafer-1.30mm Pitch,90°,SMT Wafer
Meets The EU RoHS Directive 2011/65/EU Claim
Meets The EU ELV Directive 2000/53/EC Claim
SeriesA1201 Series
MaterialNylon 4T,UL94V-0
Matching Housing:

A1201HG-XP 1.30mm Pitch,Housing,  

Product Type Features Category Wire to Board
Assembly Type Wafer
Pitch (mm) 1.30mm
Product Series A1201 Series
Configuration Features Number of Rows  1
Number of Positions  2P~12P
Electrical characteristics Operating Voltage (V AC/DC) 30
Current(Max)(A) 3
Contact Resistance 20mΩMax
Insulation Resistance 100MΩMin
Shell characteristics Housing Material Nylon 4T,UL94V-0
Color  White
PIN Material Phosphor Bronze
PIN Plating Gold over Nickel
Use the environment Operating Temperature Range (°C) -40℃~105℃
Industry Standard UL/CUL E326732