Product centerWire-To-Wire-C4201

Wafer-4.19mm Pitch,180°,Dual Row,DIP Wafer
Wire-To-Board Wire-To-Wire | Board-To-Board
Meets The EU RoHS Directive 2011/65/EU Claim
Meets The EU ELV Directive 2000/53/EC Claim
SeriesC4201 Series
Matching Housing:

C4201HFSB-2xXP 4.20mm Pitch,Dual Row,Housing,  

Product Type Features Category Wire To Wire
Assembly Type Wafer
Pitch (mm) 4.19mm
Product Series C4201 Series
Configuration Features Number of Rows  2
Number of Positions  2x2P~2x15P
Electrical characteristics Operating Voltage (V AC/DC) 600
Current(Max)(A) 9
Contact Resistance 10mΩMax
Insulation Resistance 1000MΩMin
Shell characteristics Housing Material LCP,UL94V-0
Color  Black
PIN Material Brass
PIN Plating Tin over Nickel
Use the environment Operating Temperature Range (°C) -40℃~105℃
Industry Standard UL/CUL E326732